PRODUCTS CAPABILITY

-Controller PCBA module
-Backlight module
-Display module
-RF products
-Blue-tooth/WiFi product
-OEM/ODM product
-Cable Harness

PRODUCTION TECHNOLOGY
-Surface Mount Technology (SMT)
-Wave Soldering
-Bare chip on board (COB)
-Chip on Glass (COG)
-Tape Automatic Bonding/Tape carried process (TAB/TCP)
-Chip on Flex/FPC (COF)
-Heatseal bonding
FACILITIES

-Automatic/Manual TAB Bonding Machine
-Semi Automatic COG Bonding Machine
-Ai-Plasma Cleansing Machine   Automatic bare chip bonding Machine
-High speed in line SMD Machine capable to place 0201 package
-Hot Air Reflow Oven – 6-zone to 10-zone
-Automatic Optical Inspector (AOI)
-Automatic Full-Vision Screen Printer
-Heat Seal Press    Class 100K – 10K clean room